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Continuing investment in research and development for discrete products has created a rectifier manufacturing facility that matches the precision and versatility of the most advanced integrated circuits. Dynamic Parameters versus Junction Temperature Figure Evaluate the control sample by break-apart tests to datasheef the solder connections, by physical strength tests and by dimensional characteristics for part mating. The standard characterization method consists in increas- ing the peak current in the inductor until the device fails.

For further information, contact the nearest Motorola Sales Office or franchised distributor.

The opening for the leads is still a 1: The bolt may catch on the threads of the heat sink so it is important to make sure the face of the bolt or washer is in contact with the surface of the POWERTAP. A proper character- ization should present the maximum power capability versus time.

Motorola reserves the right to make changes without further notice to any products herein. For use in common rectifier dtaasheet.

Current Derating, Case Figure 4. Forward Power Dissipation Figure To determine maximum junction temperature of the diode in a given situation, the following procedure is recommended: First is the chip, which has an interface metal between the platinum-barrier metal and nickel-gold ohmic-contact metal to eliminate any possible interaction with the barrier.


The temperature of the case should be measured using a thermocouple placed on 10 case.

Clip Mounting Position Figure 5. Peeling or plating separation is generally seen when a button is broken away for solder inspection.

Gradual cooling should be used since the use of forced cooling will increase the temperature gradient and will result in latent failure datsheet to mechanical stress.

Component Spacing Figure 3.

(PDF) BYW80-150 Datasheet download

IV Tilted buttons can cause a void in the solder between the heatsink and button rectifier which will result in poor heat transfer during operation. The data was used in Equation 1 to obtain points for Figure 9. It is important to follow the proper tightening sequence to avoid warping the heat datashfet, which can reduce thermal contact between the POWERTAP and heat sink.

The base heat sink may be of various materials whose shape and size are a function of the individual application and the heat transfer requirements. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system.

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.


Typical Reverse Current Figure 3.

datazheet These parameter tradeoffs should be considered when selecting devices for applications that can be satisfied by more than one byw0 type number. The device is tested before assembly in “sandwich” form, with the chip between the moly disks. Board where available copper surface is small. However, in contrast to ordinary junction diodes, the loss in waveform efficiency is not indicative of power loss: Values for thermal resistance components are: The top copper lead is also stress-reliefed to prevent damage during assembly.

Satisfactory circuit analysis work may be performed by using a model consisting of an ideal diode in parallel with a variable capacitance.

BYW – STMicroelectronics – Diodes, Rectifiers – Single – Kynix Semiconductor

When mounted using minimum recommended pad size on FR-4 board. Find VR equ j V. If he knows the value of the para- sitic inductance in his circuit he will be able to determine its maximum peak current. Although the power dissipation can almost be doubled with this method, area is taken up on the printed circuit board which can defeat the purpose of using surface mount technology.

Find T A max f rom equation 3.

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